SYSTEM-IN-PACKAGE USING EMBEDDED-DIE CORELESS SUBSTRATES, AND PROCESSES OF FORMING SAME

摘要

An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate, and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus may include an over-mold layer to protect the at least one device assembled on the surface.