| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method of the same, which can simplify a manufacturing process with achieving downsizing of a physical size and more definitely inhibiting potential interference between semiconductor chips. <P>SOLUTION: A manufacturing method comprises: a preparation process of structures (11, 12) in which corresponding semiconductor chips (23, 33) are mounted on one surfaces of die pads (21, 31), respectively; a molding process of injecting a resin into metal molds (100, 101) with maintaining lead frames (20, 30) in such a manner that the die pads (21, 31) face each other; and a removing process of removing tie bars (25, 35) after the molding process. In the molding process, the first lead frame (20) and the second lead frame (30) are laminated and arranged with a spacer (14) having a predetermined thickness interposed therebetween to keep a distance in a facing direction not causing potential interference between the first semiconductor chip (23) and the second semiconductor chip (33). <P>COPYRIGHT: (C)2012,JPO&INPIT |
