| 摘要 |
A laser processing work table for processing a substrate by using a laser beam includes a base plate; a plurality of supporting blocks arranged on the base plate, each of which includes one or more penetration holes and on which the substrate is arranged; and an absorption member which is connected to the base plate and transmits an absorption force via the one or more penetration holes, such that the substrate and the plurality of supporting blocks are attached to each other. |
