发明名称 LAMINATED PRINT CIRCUIT BOARD INCORPORATING ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To enable an electronic component 12a to be mounted in multiple layers. <P>SOLUTION: A laminated print circuit board 3a includes: a first wiring board 11a; a second wiring board 11c laminated on the first wiring board 11a; an electronic component 12a placed between the first wiring board 11a and the second wiring board 11c; and a spacer 11b disposed around the electronic component 12a. A single-sided board which is the type similar to the first wiring board 11a and the second wiring board 11c and has a wiring circuit 23b formed only on its one surface, is used as the spacer 11b. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012186279(A) 申请公布日期 2012.09.27
申请号 JP20110047722 申请日期 2011.03.04
申请人 FUJIKURA LTD 发明人 ISHIZUKA TAKESHI
分类号 H05K3/46;H01L23/12;H05K1/14 主分类号 H05K3/46
代理机构 代理人
主权项
地址