| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heating and cooling test method and heating and cooling test equipment that are capable of providing a temperature cycle simultaneously or individually to a plurality of electronic parts equipped on a circuit board. <P>SOLUTION: The heating and cooling test equipment includes a laser oscillator 1 that oscillates a laser beam, a beam shaping optical system 2 that shapes the laser beam, a cooling device 9 that cools a circuit board 5, temperature measuring devices 12a and 12b that measure the temperatures of electronic parts 6a to 6e, laser absorbers 7a, 7b, 7c, and 7e that are put on the upper surfaces of the electronic parts, and a control device 13 that repeatedly performs a heating step for heating the electronic parts by irradiating the upper surfaces of the absorbers put on the upper surfaces of the electronic parts with laser beams 3a, 3b, 3c, and 3e and a cooling step for cooling the electronic parts. <P>COPYRIGHT: (C)2012,JPO&INPIT |
