发明名称 CHIP ON BOARD FOR A CONTACTLESS TYPE CARD
摘要 PURPOSE: A COB(Chip On Board) of a non-contact card and a manufacturing method thereof are provided to manufacture a COB of a non-contact by preventing the scratch or cut of an antenna coil in a manufacturing process. CONSTITUTION: A base sheet in which a chip receiving hole is formed is laminated on the top of a bottom protection sheet(510). The chip is accepted in the accepting hole in order for a terminal of the chip to be located to the outside of the chip receiving hole(520). An antenna coil is laminated to the upper side of a base sheet(530). Both ends of the antenna coil is welded to the end of the chip(540). A coil protection sheet is laminated on the antenna coil of the coil welding sheet(550). [Reference numerals] (510) A base sheet in which a chip receiving hole is formed is laminated on the top of a bottom protection sheet; (520) The chip is received in the receiving hole in order for a terminal of the chip to be located to the outside of the chip receiving hole; (530) An antenna coil is laminated on the top of a base sheet where the chip receives inlayed coil winding sheet in order for both sides of the antenna coil to pass through the top of a plurality of terminal access grooves; (540) Both ends of the antenna coil is connected to the terminal of the chip which is welded to the terminal of the chip, which passes through a plurality of terminal connection grooves formed on the coil welding sheet, in a terminal connecting groove location; (550) A coil protection sheet is laminated on the antenna coil of the coil welding sheet; (560) An upper protection sheet is laminated on the top of the coil protection sheet; (570) A chip-on-board is generated by thermo compression bonding in a state that each sheet is laminated in the stages; (AA) Start; (BB) End
申请公布号 KR20120106670(A) 申请公布日期 2012.09.26
申请号 KR20120084489 申请日期 2012.08.01
申请人 SSENESTECHNOLOGY CO., LTD. 发明人 JEON, KYOUNG ILL
分类号 G06K19/077 主分类号 G06K19/077
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