发明名称 Camera module package
摘要 A camera module package is disclosed. The camera module package is capable of preventing defects caused by foreign bodies and enhancing product reliability by reducing the time consumed in a packaging process for manufacturing a camera module, and of reducing the size of a package and manufacturing costs by excluding the use of gold wires.
申请公布号 US8274600(B2) 申请公布日期 2012.09.25
申请号 US20090588958 申请日期 2009.11.03
申请人 KIM HO KYOUM;KIM GAB YONG;KWAK HYUNG CHAN;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM HO KYOUM;KIM GAB YONG;KWAK HYUNG CHAN
分类号 H04N5/225;H01L21/00;H01L23/02 主分类号 H04N5/225
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