发明名称 |
Camera module package |
摘要 |
A camera module package is disclosed. The camera module package is capable of preventing defects caused by foreign bodies and enhancing product reliability by reducing the time consumed in a packaging process for manufacturing a camera module, and of reducing the size of a package and manufacturing costs by excluding the use of gold wires. |
申请公布号 |
US8274600(B2) |
申请公布日期 |
2012.09.25 |
申请号 |
US20090588958 |
申请日期 |
2009.11.03 |
申请人 |
KIM HO KYOUM;KIM GAB YONG;KWAK HYUNG CHAN;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM HO KYOUM;KIM GAB YONG;KWAK HYUNG CHAN |
分类号 |
H04N5/225;H01L21/00;H01L23/02 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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