| 摘要 |
A repair structure including a substrate, at least one first conducting line, a first insulating layer, at least one second conducting line and a repair connecting layer is provided. The at least one first conducting line is disposed on the substrate. The first insulating layer is disposed over the substrate to cover the first conducting line. The second conducting line is disposed over the first insulating layer. The second insulating layer covers the second conducting line and the first insulating layer. The repair connecting layer is disposed on the second insulating layer. In particular, the repair connecting layer is electrically connected to the first conducting line. The repair connecting layer overlaps the second conducting line but is electrically insulated from the second conducting line. |
