| 摘要 |
<p>PURPOSE: A tray supporting treatment device for a semiconductor package capable of a high heat treatment is provided to prevent flexure or deformation generation in a high heat treatment process when a semiconductor package is assembled, thereby implementing stable quality. CONSTITUTION: A tray supporting treatment device includes g-clip(20) or end cap with colors whose heat resistant resin is 78-80%, antistatic agent is 15-30%, and Teflon is 0.5-2%. The tray supporting treatment device includes the g-clip or the end cap with a black color of which the heat resistant resin is 95-98.5%, a carbon nanotube material is 0.5-5%, and the Teflon is 0.5-2%. The g-clip displays a current process state of the tray which is inserted in a side of the tray.</p> |
