SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to control the damage caused by a stage to be generated on the rear side of a wafer while preventing the degradation of productivity. CONSTITUTION: A semiconductor wafer(10) is replaced on a stage. An insulating layer(20) and a concave part(22) are formed on the semiconductor wafer. A conductor film(30) is formed on the bottom of the concave part and the top and sidewall of the insulating layer. The conductor film is formed with a CVD(Chemical Vapor Deposition) method or an ALD(Atomic Layer Deposition) method. An unnecessary portion of the conductor film formed on the top of the insulating layer is eliminated.