| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a heat dissipation efficiency in a cooling device of a semiconductor power module in which the semiconductor power module is installed onto a heat sink, a groove is provided in a plane of the heat sink on a side where the semiconductor power module and the heat sink are contacted with each other, a heat transfer tube is embedded and provided in this groove, and thereby, heat generated from the semiconductor power module is absorbed by the heat sink and dissipated to the outside. <P>SOLUTION: In a cooling device of a semiconductor power module, a heat pipe is used as a heat transfer tube. The heat pipe whose cross-sectional shape is deformed to fit a cross-sectional shape of a groove is embedded and provided in the groove. <P>COPYRIGHT: (C)2012,JPO&INPIT |
