| 摘要 |
The present invention relates to a spring contact and a socket embedded with spring contacts. The spring contact comprises: an upper contact pin, which includes a contact portion of a predetermined shape intended to be in contact with the lead of a separate semiconductor IC to be inspected, two spring-fixed protrusions and a body; a lower contact two spring-fixed protrusions and a body; a lower contact pin coupled orthogonally to the upper contact pin; and a spring to be inserted between the upper contact pin and the lower contact pin, wherein the body has an oblique end surface with a locking protrusion formed thereon and two symmetric elastic portions, and wherein the two elastic portions form inside thereof an escape groove to provide a flow space when coupled with the lower contact pin and a flow groove to receive the locking protrusion of the lower contact pin and allow it to flow therein, the flow groove being intended to have an electric contact with the locking protrusion of the lower contact pin and with a side contact portion. Further, the present invention provides a variety of structure, such as a structure for minimizing a compressed length of a contact, a structure for an in-line fine pitch spring contact and socket or a structure for a soldered spring contact and socket.
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