| 发明名称 |
POLYESTER RESIN COMPOSITION |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyester resin composition used for an adhesive tape peelable even after thermal history, wherein the resin composition is excellent in heat resistance and can be attached without heating the resin composition or applying pressure to the resin composition. <P>SOLUTION: A polyester resin composition for an adhesive contains a polyester resin, an isocyanate crosslinking agent, and a specific bismaleimide compound. A polyester adhesive can be produced by: heating the polyester resin composition for the adhesive; and subsequently subjecting the resin composition thus heated to ultraviolet irradiation. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012180409(A) |
申请公布日期 |
2012.09.20 |
| 申请号 |
JP20110042768 |
申请日期 |
2011.02.28 |
| 申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
UCHIDA HIROAKI;IMAMURA SHIGEKI |
| 分类号 |
C08L67/00;C08K5/29;C08K5/3415;C09J7/02;C09J127/12;C09J167/00;C09J175/06 |
主分类号 |
C08L67/00 |
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