发明名称 |
LIGHT EMITTING DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF |
摘要 |
A light emitting device (LED) package and a manufacturing method thereof are provided. The LED package includes a circuit board comprising at least one device region, a plurality of electrode regions, at least one first thermal via exposed through upper and lower surfaces of the at least one device region, and a plurality of second thermal vias exposed through upper and lower surfaces of the plurality of electrode regions; at least one first thermal pad bonded to the upper surface of the at least one device region and connected to the first thermal via; at least one LED mounted on the at least one first thermal pad; a plurality of first electrode pads bonded to the upper surface of the electrode region and connected to the second thermal vias; and a plurality of wires to connect the at least one LED with the plurality of first electrode pads.
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申请公布号 |
US2012236568(A1) |
申请公布日期 |
2012.09.20 |
申请号 |
US201213414179 |
申请日期 |
2012.03.07 |
申请人 |
LEE DONG YEOUL;MIN KYEONG IK;LEE CHANG SUB |
发明人 |
LEE DONG YEOUL;MIN KYEONG IK;LEE CHANG SUB |
分类号 |
H05K7/20;F21V29/00;H05K3/30 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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