发明名称 LED PACKAGE
摘要 An LED package comprises a substrate, a reflector, a light-absorbing layer, an encapsulation layer and an LED chip. The light-absorbing layer is located around the reflector and is able to absorb any light which penetrates through the reflector. Therefore, any vignetting or halation of light from the LED package is prevented. Moreover, the LED package can be constructed on a very small scale with no reduction in its color rendering properties.
申请公布号 US2012235193(A1) 申请公布日期 2012.09.20
申请号 US201113288042 申请日期 2011.11.03
申请人 HU PI-CHIANG;HSU SHIH-YUAN;WANG KAI-LUN;ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. 发明人 HU PI-CHIANG;HSU SHIH-YUAN;WANG KAI-LUN
分类号 H01L33/60 主分类号 H01L33/60
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