| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame substrate for an LED element capable of reducing a burr of a tie-bar generated during cutting work and a load of a cutting tool. <P>SOLUTION: A lead frame substrate 11 for forming a singulated lead frame substrate having unit lead frames 1B in which an LED chip mounting part 2 and an electrical connection area part 3 are spaced apart from each other in a Y direction and are arranged opposite to each other, comprises a lead frame 1 in which the plurality of unit lead frames 1B arranged spaced apart from each other in the Y direction are coupled to the lead frame 1 via tie-bar parts 60, 70 extending in a X direction crossing the Y direction; and a resin part covering a part of the lead frame 1 except parts of the LED mounting part 2 and the electrical connection area part 3. The singulated lead frame substrate can be produced by cutting the resin part and tie-bar parts 60, 70 in the Y direction and the resin part in the X direction, respectively. <P>COPYRIGHT: (C)2012,JPO&INPIT |
