发明名称 DEVICE FOR CUTTING MOLDING SHEET
摘要 <P>PROBLEM TO BE SOLVED: To provide a device for cutting a molding sheet, which can preferably perform thermal cutting of a molding sheet without causing a cut slippage in the molding sheet. <P>SOLUTION: The device for cutting a molding sheet includes a cutting unit for thermally cutting the molding sheet while piling up a plurality of molding sheets. The cutting unit includes: a stretched heating wire; and a movement mechanism for moving at least one of the heating wire and the molding sheet and bringing into contact both members with each other to thermally cut the molding sheet by the heating wire. The device for cutting a molding sheet further includes a movement speed control device 32 for controlling a movement speed in an area on a thermal cutting completion side of at least one of the heating wire and the molding sheet that is moved by the movement mechanism, to be slower than that in an area on a thermal cutting starting side. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012179665(A) 申请公布日期 2012.09.20
申请号 JP20110042451 申请日期 2011.02.28
申请人 SEKISUI PLASTICS CO LTD;SEKISUI PLASTICS OKINAWA CO LTD 发明人 TAMURA JIN;HIYANE YOSHIKUNI
分类号 B26F3/12 主分类号 B26F3/12
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