发明名称 LIGHT EMITTING DIODE PACKAGE STRUCTURE
摘要 The invention provides a light emitting diode package structure, including: a light emitting diode chip formed on a substrate; a composite coating layer formed on the light emitting diode chip, wherein the composite coating layer comprises a first coating layer and a second coating layer, and the composite coating layer has a reflectivity greater than 95% at the wavelength of 500-800 nm; a cup body formed on the substrate, wherein the cup body surrounds the light emitting diode chip; and an encapsulation housing covering the light emitting diode chip, wherein the encapsulation housing comprises a wavelength transformation material.
申请公布号 US2012235198(A1) 申请公布日期 2012.09.20
申请号 US201213421522 申请日期 2012.03.15
申请人 CAI PEI-SONG;LIN TZU-PU;FU SZU-WEI;LEXTAR ELECTRONICS CORPORATION 发明人 CAI PEI-SONG;LIN TZU-PU;FU SZU-WEI
分类号 H01L33/52;H01L33/60 主分类号 H01L33/52
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