| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-resistant adhesive tape which preferably inhibits resin leakage in an encapsulation process by the heat-resistant adhesive tape in a manufacturing process of QFN using a roughening processed lead frame and yet an attached tape is hard to create problems in a series of processes. <P>SOLUTION: A semiconductor manufacturing method comprises at least: a mounting process of bonding a semiconductor chip 15 on a die pad 11c of a metal lead frame 10 on which a heat-resistant adhesive tape 20 is attached on an outer pad side of the lead frame 10 having a roughening processed surface; a wire connection process of electrically connecting a tip of a terminal part 11b of the lead frame with an electrode pad 15a on the semiconductor chip by a bonding wire 16; and an encapsulation process of performing single side encapsulation on the semiconductor chip side by an encapsulation resin 17. The heat-resistant adhesive tape uses a support base material which shows no glass-transition temperature (Tg) in a temperature range of 300°C and under. <P>COPYRIGHT: (C)2012,JPO&INPIT |
