ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an electronic component mounting substrate that eliminates the need for a special member such as underfill material and prevents formation of cracks in a junction between an electronic component and a wiring substrate due to external impact or heat stress.

SOLUTION: An electronic component mounting substrate includes at least one printed substrate that has: an insulating substrate that includes resin; and a conductor wiring layer formed on at least one surface of the insulating substrate. The electronic component mounting substrate has: a wiring substrate that has a plurality of land electrodes on a surface thereof; and an electronic component that has a plurality of terminal electrodes on a surface thereof. The land electrodes and the terminal electrodes are electrically connected through a bonding member. The bonding member includes an intermetallic compound with a melting point of 300°C or more that is formed by a reaction of a first metal including Sn and a second metal with a higher melting point than that of the first metal. A difference between lattice constants of the second metal and the intermetallic compound that is initially formed on a surface of the second metal is 50% or more of the lattice constant of the second metal. The bonding member has a plurality of air voids therein.

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