发明名称 |
PRESSURE-SENSITIVE ADHESIVE TAPE FOR TEMPORARY FIXING OF ELECTRONIC PART |
摘要 |
In the production process of electronic parts, the static electricity generated when peeling a pressure-sensitive adhesive tape has interfered with the performance of the electronic parts. This problem has been solved by a pressure-sensitive adhesive tape for temporary fixing of electronic parts of the present invention including at least a supporting substrate film and a thermally expandable pressure-sensitive adhesive layer provided on one side of the substrate, wherein the thermally expandable pressure-sensitive adhesive layer contains thermally expandable microspheres and an ionic liquid; the content of the ionic liquid is 0.01 to 10 parts by weight based on 100 parts by weight of a polymer contained in the thermally expandable pressure-sensitive adhesive layer; the surface resistance of the thermally expandable pressure-sensitive adhesive layer is 1.0×1013Ω/□or less; and the ratio of the surface resistance after heating for foaming to that before the heating is 5.0 or less.
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申请公布号 |
US2012237764(A1) |
申请公布日期 |
2012.09.20 |
申请号 |
US201213421114 |
申请日期 |
2012.03.15 |
申请人 |
SOEJIMA KAZUKI;SHIMOKAWA DAISUKE;HIRAYAMA TAKAMASA;NITTO DENKO CORPORATION |
发明人 |
SOEJIMA KAZUKI;SHIMOKAWA DAISUKE;HIRAYAMA TAKAMASA |
分类号 |
B32B7/12 |
主分类号 |
B32B7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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