发明名称 PREPREG FOR BUILD-UP
摘要 <p>This prepreg (1) for build-up is provided with a fiber substrate (2) and with a resin layer provided on both sides thereof. Conforming to IPC-TM-650 Method 2.3.17, the resin flow of the prepreg measured after heating and pressing for 5 minutes under conditions of 171±3°C and 1380±70kPa is not less than 15 weight% and not greater than 50 weight%.</p>
申请公布号 WO2012124307(A1) 申请公布日期 2012.09.20
申请号 WO2012JP01685 申请日期 2012.03.12
申请人 SUMITOMO BAKELITE CO., LTD.;ENDO, TADASUKE;MITSUI, YASUAKI 发明人 ENDO, TADASUKE;MITSUI, YASUAKI
分类号 H05K3/46;B32B15/08;B32B27/12;H05K1/03 主分类号 H05K3/46
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