| 摘要 |
<p>In a semiconductor module (100) wherein a semiconductor chip, main-circuit terminals (4), and control terminals (5) are bonded to a conductive-pattern-bearing insulating substrate (2) bonded to a metal heat-dissipating substrate (1), a resin case (8) having first holes (11) that expose the control terminals (5) and the surfaces of the main-circuit terminals (4) is bonded to the metal heat-dissipating substrate (1), resin bodies (7) containing embedded nuts (22) that anchor the main-circuit terminals (4) and control terminals (5) are inserted into second holes (11) formed in the side walls of the resin case (8), and the resin case (8) is filled with a resin material (9), the side walls (18) of each first hole (11) are tapered towards the surface side; the control terminals (5) are provided with tapered contact parts (19) that contact the aforementioned tapered side walls; and the resin bodies (7) containing embedded nuts (22) anchoring the control terminals (5), said control terminals being cantilevered independent terminals, make it possible to make the surface heights (17) of said control terminals (5) uniform with high precision.</p> |
