| 摘要 |
FIELD: electricity. ^ SUBSTANCE: invention can be used at manufacture of multi-layer printed-circuit boards (MPB) used during design of radio electronic equipment. MPB are obtained by bonding of two-sided and one-sided printed-circuit boards along flat surface through separating dielectric layers from glass fabric saturated with organic bonding agents; at that, electrical diagrams are not available on external surface of bonded boards. Then, through and blind bypass openings are drilled and metal wire with low electric resistance, for example copper, aluminium, or molybdenum, or silver one the diameter of which exceeds the diameter of bypass opening not more than by 5%, is inserted throughout the depth of the latter; after that, on external surface of bonded printed-circuit boards there applied subsequently is thin metal coating, by means of thermodecomposition of metal organic compounds (MOC) of nickel or copper, or cobalt, or molybdenum with thickness of 1.5-3 mcm; polymer organic substance in the form of film, and then, using photolithography or laser beam, or by milling there created is pattern of electrical diagrams, after which electroplated copper coating of required thickness is applied to the sections not protected with polymer film and protective metal resistive coating above it and residues of polymer and thin metal coating is removed. ^ EFFECT: simpler process for obtaining of multi-layer printed-circuit boards not containing any moisture, installation of electric contact between layers, which does not destruct at temperature drop; reduction of wastes of chemical electroplated manufacture. |
