发明名称 SENSOR DEVICE MANUFACTURING METHOD AND SENSOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a sensor device manufacturing method and a sensor device which reduce an impact on sensor property in a manner that prevents a metal electrode of a sensor from corrosion due to high humidity of external air and protects a sensor from an occurrence of warpage due to a resin seal thereof. <P>SOLUTION: A sensor device manufacturing method includes the following steps of: arranging, on a substrate, a sensor having a fixed section, a movable section positioned inside the fixed section, a flexible section connecting the fixed section and the movable section, a plurality of metal electrodes, and a sensor cap which covers the movable section and the flexible section and exposes the metal electrodes; electrically connecting a plurality of the metal electrodes of the sensor and a plurality of terminals of the substrate with bonding wires; removing a top portion of the sensor cap so as to expose a portion of the bonding wires between the plurality of metal electrodes and the plurality of terminals; and covering, with resin, portions where the plurality of metal electrodes of the sensor and the bonding wires are connected. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012181198(A) 申请公布日期 2012.09.20
申请号 JP20120086208 申请日期 2012.04.05
申请人 DAINIPPON PRINTING CO LTD 发明人 TAKANO TAKAMASA
分类号 G01P15/08;G01P15/12;G01P15/18;H01L21/56;H01L29/84 主分类号 G01P15/08
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