| 摘要 |
<p>The invention discloses a Printed Circuit Board (PCB) with radiating structure, and the PCB includes a conduction layer (201) and a PCB carrier layer (202), and the PCB carrier layer (202) is a multiaperture heat-conducting layer, and heat-conducting liquid or solid-liquid phase-change heat-conducting material is injected into the apertures of the multiaperture heat-conducting layer; the conduction layer (201) is set on the first side of the multiaperature heat-conducting layer, and the second side of the multiaperture heat-conducting layer is the contact interface with the outside medium. The PCB carrier layer (202) of the invention is the multiaperture heat-conducting layer which is made of multiaperture material with good heat conductivity, and the heat-conducting liquid such as heat-conducting ink etc., or the solid-liquid phase-change heat-conducting material is injected into the apertures of the multiaperture heat-conducting layer; when the PCB is heated, the heat-conducting ink is precipitated from the multiaperture material due to the expansion coefficient of the multiaperture heat-conducting material being not consistent with that of the heat-conducting ink, and on the contact interface of PCB, the precipitated ink fills the air interstice between the contact interface and the outside medium due to capillary action, therefore, the heat resistance from LED to the contact interface is greatly reduced, and the heat conductivity of PCB is raised with low cost, simple structure and convenient installation.</p> |
