| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for chip seals, which comprises PPS as a matrix and proper types and amounts of selected and added fillers, has both a low cost and low abrasion characteristics on relatively rough metal surfaces in comparison with conventional technical PPS-based materials, without deteriorating chemical resistance, heat resistance and mechanical characteristics, and is excellent in thin moldability, and to provide a chip seal. <P>SOLUTION: The resin composition for the chip seals includes 60 to 80 wt.% of at least one polyphenylene sulfide resin having a melt viscosity of 5 to 50 Pa s at a resin temperature of 300°C and at a shear rate of 10<SP POS="POST">3</SP>[1/sec], 1 to 10 wt.% of at least one of glass bulbs and barium titanate, and the remainder of carbon fibers and at least one of polytetrafluoroethylene resin and graphite. <P>COPYRIGHT: (C)2012,JPO&INPIT |
