| 摘要 |
The invention relates to a package for a semiconductor device (10). The package comprises a first conductive terminal (1) having a first region (RG1) on a first surface (A1) at a first side (S1) thereof, the first region (RG1) is configured for receiving the semiconductor device (10), the first conductive terminal (1) extending to an exterior of the package for being electrically connected to an external electronic circuit. The package further comprises a protruding conductive member (11) that is provided in a second region (RG2) on the first side (S1) of the first conductive terminal (1) next to the first region (RG1), wherein the protruding conductive member (11) has a second surface (A11) that is configured for being wire bonded to at least one bondpad of the semiconductor device (10). The invention further relates to a packaged semiconductor device comprising such package. The invention also relates to an electronic circuit comprising such packaged semiconductor device. The invention further relates to a method of manufacturing a package for a semiconductor device. The invention enables back-side contacting of packages with non-conductive substrates. The invention results in a package which is easy to manufacture and which is substantially cheaper than the prior art solutions. |
