EPOXY COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED WITH THE SAME

摘要

PURPOSE: An epoxy composition for sealing semiconductor devices is provided to manufacture a semiconductor device with high reliability and moldability by improving warpage properties due to temperature change by having improved high temperature dimensional stability, hardening effectiveness and degree because of high glass transition temperature. CONSTITUTION: An epoxy composition for sealing semiconductor devices comprises an epoxy compound, a hardener, a curing accelerator, and filler. The epoxy compound is a naphthalene-based epoxy dimer with two naphthalene-based core units in chemical formula 1. In chemical formula 1, The naphthalene-based unit 1 and 2 is independently selected from a group consisting of chemical formula 2-1 and chemical formula 2-2. In chemical formula 2-2, R is a single bond or a C1-C5 alkanediyl group. The equivalent ratio of the hardener to the epoxy compound is 0.5-1.5. [Reference numerals] (AA) Naphthalene unit 1; (BB) Naphthalene unit 2