发明名称 |
MOTHERBOARD CUTTING METHOD, MOTHERBOARD SCRIBING APPARATUS, PROGRAM AND RECORDING MEDIUM |
摘要 |
<p>A mother substrate cutting method for cutting a plurality of unit substrates out of a mother substrate, comprises the steps of: (a) forming scribe lines on the mother substrate by scribe forming means; and (b) breaking the mother substrate along the scribe lines, wherein the step (a) includes a step of forming a first scribe line for cutting a first unit substrate out of the mother substrate and a second scribe line for cutting a second unit substrate out of the mother substrate by moving the scribe forming means with respect to the mother substrate without a pressure to the mother substrate by the scribe forming means being interrupted.</p> |
申请公布号 |
KR101181707(B1) |
申请公布日期 |
2012.09.19 |
申请号 |
KR20067023811 |
申请日期 |
2005.05.19 |
申请人 |
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发明人 |
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分类号 |
C03B33/02;B28D5/00;C03B33/023;C03B33/027;C03B33/03;C03B33/033;C03B33/037;C03B33/04;C03B33/07;C03B33/10;G02F1/13;G02F1/1333 |
主分类号 |
C03B33/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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