| 摘要 |
A backlight device (3) includes: a light guide plate (32); a chassis (31) on which the light guide plate (32) is mounted; a frame member (35) having the light guide plate (32) held between the chassis (31) and the frame member (35); a spot light source (36) arranged near a side surface of the light guide plate (32); a flexible printed circuit board (37) on which the spot light source (36) is mounted; and a heat dissipation plate (31a) (part of the chassis (31)) bonded through a double-faced adhesive (38) to the flexible printed circuit board (37). The frame member (35) is provided with a protrusion portion (351) that is in contact with the flexible printed circuit board (37) and that presses the flexible printed circuit board (37) onto the heat dissipation plate (31a), and a tip portion of the protrusion portion (351) is so tapered as to be located apart from the flexible printed circuit board (37). |
