发明名称 |
Semiconductor module and camera module mounting said semiconductor module |
摘要 |
A semiconductor module includes a lower wiring substrate having a semiconductor device mounted and an upper wiring substrate having an opening in a position corresponding to the semiconductor device and having a packaging-component mountable region around the opening. The lower wiring substrate and the upper wiring substrate are electrically connected to each other via a plurality of solder balls provided around the semiconductor device. The solder balls are covered with light blocking under-fills. |
申请公布号 |
US8269298(B2) |
申请公布日期 |
2012.09.18 |
申请号 |
US20100727913 |
申请日期 |
2010.03.19 |
申请人 |
NAGAMATSU MASAYUKI;USUI RYOSUKE;INOUE YASUNORI;SANYO ELECTRIC CO., LTD. |
发明人 |
NAGAMATSU MASAYUKI;USUI RYOSUKE;INOUE YASUNORI |
分类号 |
H01L21/00;H01L27/14;H04N5/225;H04N5/335;H04N5/374 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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