| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device with no bump, the semiconductor device and an exposure apparatus. <P>SOLUTION: A photosensitive negative resist material that becomes a lower layer resist film is applied onto a film 2 to be processed. Acid is generated by irradiating the lower layer resist material film with exposure light. A lower layer resist film 3b is formed by applying bake processing. By applying development processing, a portion of a non-crosslinked lower layer resist material film is removed while leaving the crosslinked lower layer resist film 3b. By applying a photosensitive negative resist material that becomes an intermediate layer resist film and applying similar exposure processing and development processing, a portion of a non-crosslinked intermediate layer resist material film is removed while leaving the crosslinked intermediate layer resist film 4b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
