发明名称 SILICON-CARBIDE JUNCTION BARRIER SCHOTTKY DIODE AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To selectively form a p<SP POS="POST">+</SP>region on a p-well and to reduce contact resistance of a metal electrode and the p<SP POS="POST">+</SP>region without using a hard mask in manufacturing a silicon-carbide junction barrier Schottky diode. <P>SOLUTION: A p<SP POS="POST">+</SP>region 4 is formed over an entire upper portion of an n-type epitaxial layer 2 by high-temperature ion implantation, and an n-type region below the p<SP POS="POST">+</SP>region 4a is partially exposed by selectively etching the p<SP POS="POST">+</SP>region 4a, thereby forming a p<SP POS="POST">+</SP>semiconductor projection 4 which is protruded upward from an upper surface of the n-type region. An anode electrode is formed to cover the exposed portion of the n-type region and the p<SP POS="POST">+</SP>semiconductor projection 4. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012178494(A) 申请公布日期 2012.09.13
申请号 JP20110041223 申请日期 2011.02.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 OKUNO KOJI;TARUI YOICHIRO
分类号 H01L29/47;H01L21/329;H01L29/06;H01L29/861;H01L29/868;H01L29/872 主分类号 H01L29/47
代理机构 代理人
主权项
地址