发明名称 |
STABLE AND ITERABLE PLASMA ION IMPLANTATION METHOD, AND DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for at least partially compensating an undesired effect of the interaction between ions to be implanted and a substrate in a plasma ion implanter. <P>SOLUTION: The method for plasma ion implantation on a substrate comprises the steps of: providing a plasma ion implanter which includes a process chamber, a source for generating plasma in the process chamber, a platen for holding the substrate in the process chamber, and a pulse source for generating an implantation pulse for accelerating ions directed to the substrate from plasma; executing plasma ion implantation on the substrate according to an implantation processing; and controlling the energy of the ions during the implantation to at least partially compensate an undesired effect of the interaction between the ions to be implanted and the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012178571(A) |
申请公布日期 |
2012.09.13 |
申请号 |
JP20120079462 |
申请日期 |
2012.03.30 |
申请人 |
VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES INC |
发明人 |
WALTER STEVEN R;FANG ZIWEI;TOCCO JUSTIN;CARLETON F ELLIS III |
分类号 |
H01L21/265;C23C14/48;H01J37/32;H01L21/223;H01L21/26;H01L21/42;H05H1/46 |
主分类号 |
H01L21/265 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|