发明名称 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component which is capable of radiating heat from a heat generating element with high efficiency, and a manufacturing method thereof. <P>SOLUTION: On a substrate, a heat radiating material is disposed which has linear structures of carbon elements and a thermoplastic resin filling layer disposed between the linear structures. Next, blotting paper is disposed on the heat radiating material, thermal treatment is performed at a higher temperature than a melting temperature of the thermoplastic resin, and the thermoplastic resin on the linear structure is blotted by the blotting paper. Thereafter, the blotting paper is removed, the thermoplastic resin is then solidified by cooling and the heat radiating material is adhered onto the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012178397(A) 申请公布日期 2012.09.13
申请号 JP20110039561 申请日期 2011.02.25
申请人 FUJITSU LTD 发明人 HIROSE SHINICHI;IWAI DAISUKE;YAMAGUCHI YOSHITAKA;YAGISHITA YOHEI;SAKIDA YUKIE;NORIMATSU MASAAKI
分类号 H01L23/36;H05K7/20 主分类号 H01L23/36
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