| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a water-repellent protective film forming solution that contains a water-repellent protective film forming agent for forming a water-repellent protective film on at least one recessed surface of a wafer to clean the metal wafer. <P>SOLUTION: A wafer has surfaces with an uneven pattern formed thereon, and at least one portion of recessed surfaces of the uneven pattern include at least one kind of substance selected from a group consisting of titanium, titanium nitride, tungsten, aluminum, copper, tin, tantalum nitride, and ruthenium. A water-repellent protective film forming solution contains a water-repellent protective film forming agent for forming a water-repellent protective film on the recessed surfaces of the wafer (metal wafer). Also provided is a method for cleaning the wafer for forming the protective film on the recessed surface using the solution to reduce interaction between liquid retained in the recess and the recessed surface, thereby improving cleaning process that tends to induce a pattern collapse. <P>COPYRIGHT: (C)2012,JPO&INPIT |
