CONDUCTIVE PARTICULATE AND SUBSTRATE CONSTITUENT

摘要

PROBLEM TO BE SOLVED: To provide a conductive particulate having capacity capable of easing force applied to a circuit of a substrate or the like and to provide a method for maintaining a distance between substrates at a fixed value.

SOLUTION: In a conductive particulate configured by covering the surface of a base material particulate composed of resin with one or more metal layers, respective thermal expansion coefficients of all the metal layers are 1×10-5to 3×10-5(1/K) and a ratio (thermal expansion coefficient of base material particulate/thermal expansion coefficient of metal layer) of the thermal expansion coefficient of the base material particulate to that of each metal layer is 0.1 to 10.

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