| 摘要 |
<p>Provided is a heat-dissipation structure that has a reduced thickness of a heat-transfer sheet or can eliminate the heat-transfer sheet. The heat-dissipation structure (1A) has: a substrate (30); heat-releasing components (3, 4, 5) installed on the obverse of the substrate (30); a heat-dissipation plate (9) that is attached at the obverse side of the substrate (30) and that presses the top surface of the heat-releasing components (3, 4, 5); and a locking component (40). The heat-dissipation plate (9) has first slits (11a, 11b) of which one end extends to the vicinity of the locking component (40) and that partition between the center of a first pressing region that presses heat-releasing component (3) and the center of a second pressing region that presses the other heat-releasing components (4, 5).</p> |
