| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a molding die capable of suppressing the occurrence of deformation of an electronic substrate and filling failure when sealed the electronic substrate by injection molding using thermoplastic resin, to provide a method of sealing an electronic substrate using the molding die, and to provide a thermoplastic resin sealed electronic substrate manufactured by the method of sealing the electronic substrate using the mold die. <P>SOLUTION: The electronic substrate is sealed by injection molding using thermoplastic resin using the molding die including: (a) a gate provided at the front face side of the electronic substrate; (b) a recessed part I for forming an induction part on the back face of the electronic substrate; (c) a supply passage communicating the gate with the recessed part I; (d) a recessed part II communicated with the supply passage and the recessed part I on the surface of the electronic substrate and forming a covering part formed on the surface of the electronic substrate thinner than the induction part; and (e) a supporting body provided on the back face of the electronic substrate, which is capable of abutting on and separating from the back face of the electronic substrate and which supports the electronic substrate by abutting on the back face of the electronic substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
