ADHESIVE FOR ELECTRONIC COMPONENTS, AND MANUFACTURING METHOD FOR SEMICONDUCTOR CHIP MOUNT

摘要

One purpose of the present invention is to provide an adhesive for electronic components that suppresses the formation of voids and is not susceptible to piling up on a semiconductor chip surface. Furthermore, another purpose of the present invention is to provide a manufacturing method for a semiconductor chip mount using the adhesive for electronic components. An adhesive for electronic components that contains a curable compound, a curing agent, and an inorganic filler, wherein if A1 represents the viscosity (Pa·s) at 5rpm, as measured by using an E-type viscometer at 25°C, and A2 represents the viscosity (Pa·s) at 0.5rpm, then A1 and A2/A1 are within the range indicated by the solid and broken lines in figure 1 (the solid line itself is included but the broken line itself is not included). The content of the curing agent is 5-150 parts by weight and the content of the inorganic filler is 60-400 parts by weight per the curable compound being 100 parts by weight of the current composition.