| 摘要 |
Provided are an adhesive sheet having a conductive die attach film that is superior in semiconductor chip-holding efficiency and pick-up efficiency and an electronic component prepared by using the adhesive sheet. An adhesive sheet, including a base film, an adhesive layer laminated on one face of the base film and a die attach film containing a conductive filler laminated on the adhesive layer, wherein the adhesive layer is shaped from a bonding composition containing a multifunctional isocyanate curing agent: 0.5 to 20 parts by mass with respect to a (meth)acrylic ester copolymer having a carboxyl group-containing monomer's copolymerization rate of less than 0.5%:100 parts by mass. |
