| 摘要 |
PURPOSE: A chemical and mechanical polishing composition is provided to be stably condensed and to reduce process flow, thereby capable of minimizing manufacturing footprint, and reducing transportation and storage cost. CONSTITUTION: A chemical and mechanical polishing composition which is useful for chemically and mechanically polishing a semiconductor wafer containing interconnect metal comprises water, azole inhibitor, alkali metal organic surfactant, hydrope, phosphor-containing agent, selectively a non-saccharide water-soluble polymer, selectively an aqueous acid compound in chemical formula 1, selectively a complexing agent, selectively an oxidizer, selectively an organic solvent, and selectively an abrasive. In chemical formula 1, R is selected from hydrogen and a C1-5 alkyl group, and x is 1 or 2.
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