发明名称 HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat treatment apparatus and a heat treatment method capable of heating a film formed on the front surface of a substrate, regardless of the kind of the film, to a fixed processing temperature. <P>SOLUTION: A reverse surface of a substrate W, on a front surface of which a resist film RF is formed by applying photoresist coating liquid, is irradiated with flash light from a flash lamp FL. The flash light irradiation abruptly rises the temperature of the reverse surface of the substrate W to cause heat conduction from the reverse surface to the front surface, and the resist film RF formed on the front surface is heated to perform after-coating bake treatment. Subsequent to the after-coating bake treatment, the substrate W is cooled by a cooling plate 85 arranged in proximity to maintain a normal temperature. By irradiating the reverse surface of the substrate W with flash light, regardless of the kind of the resist film RF formed on the front surface, flash-light absorption rate of the substrate W becomes constant so that the resist film RF can be heated to a fixed processing temperature. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012174819(A) 申请公布日期 2012.09.10
申请号 JP20110034146 申请日期 2011.02.21
申请人 SOKUDO CO LTD 发明人
分类号 H01L21/027 主分类号 H01L21/027
代理机构 代理人
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