| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive jointing material whereby a conductive jointing material supply process for depositing the conductive jointing material while supplying the conductive jointing material to the electrode of a substrate and a transfer process for transferring the conductive jointing material to the terminal of an electronic component by fusing it once can be selected, and the electronic component can be efficiently jointed to the substrate at low temperatures of 150°C or lower, and to provide a method of jointing a conductor and a method of manufacturing a semiconductor. <P>SOLUTION: The conductive jointing material contains a metal component comprising a high melting-point metal particle having a melting point of 150°C or higher, an intermediate melting-point metal particle having a melting point of not less than 80°C and not more than 139°C, and a low melting-point metal particle having a melting point of 79°C or lower. The metal component is preferably a multi-layer metal particle having an intermediate melting-point metal layer formed from the intermediate melting-point metal particle, and a low melting-point metal layer formed from the low melting-point particle in this order on the surface of the high melting-point metal particle. <P>COPYRIGHT: (C)2012,JPO&INPIT |
