发明名称 NOVEL WHITE COVER LAY FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a cover lay film with a white resin layer, which has at least one kind or more of advantages, such as no process contamination, high flexibility, high whiteness, high reflectance, excellent flame retardancy, no bleeding-out during hot pressing, and reduced reflectance-hue change after irradiation with light, and to provide a printed wiring board. <P>SOLUTION: There is provided a white cover lay film comprising at least a white thermosetting resin composition layer and a polyimide film, the white thermosetting resin composition layer containing (A) a thermosetting resin substantially containing no silicon in a molecule, (B) a white coloring agent and (C) a filler-type flame retardant. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012175053(A) 申请公布日期 2012.09.10
申请号 JP20110038454 申请日期 2011.02.24
申请人 KANEKA CORP 发明人 SHIMIZU MASAYOSHI;MATSUTANI AKIO
分类号 H05K3/28;B32B27/34 主分类号 H05K3/28
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