| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for producing an aluminum-silicon carbide composite with excellent productivity in an impregnation method and to provide the aluminum-silicon carbide composite suitable as a base plate for a ceramic circuit board. <P>SOLUTION: When a silicon carbide porous body is laminated, it is sandwiched by two mold release plates so that the parallelism of the two mold release plates becomes 0.03 mm or less and laminated and a metal whose main ingredient is aluminum is impregnated by pressurization from 20% or more of the side opening area of the silicon carbide porous body. In addition, when being laminated, an aluminum foil whose main ingredient is aluminum is sandwiched between the mold release plate and a spacer or the mold release plate and the silicon carbide porous body and then lamination is performed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
