发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR STORAGE DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a configuration in which a gap is formed between adjacent memory cells and between the memory cells and a selective transistor and which suppresses short-circuiting of the selective transistor and peripheral circuits. <P>SOLUTION: A semiconductor storage device according to an embodiment comprises a memory cell string in which a plurality of memory cells, each including a gate, are connected in series. A selective transistor is connected to an end memory cell provided at one end of the memory cell string. A sidewall film coats a side surface of a gate of the end memory cell and a side surface of a gate of the selective transistor between the end memory cell and the selective transistor. A gap is formed between the sidewall film of the end memory cell and the sidewall film of the selective transistor. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012174869(A) 申请公布日期 2012.09.10
申请号 JP20110034963 申请日期 2011.02.21
申请人 TOSHIBA CORP 发明人 ISOMURA RYOSUKE;SAKAMOTO WATARU;NITTA HIROYUKI
分类号 H01L27/115;H01L21/336;H01L21/8247;H01L29/788;H01L29/792 主分类号 H01L27/115
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