| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for manufacturing a semiconductor which enable oily silane to be safely removed without deteriorating throughput. <P>SOLUTION: A semiconductor manufacturing apparatus of this invention includes: a reaction chamber into which a wafer is brought; a process gas supply mechanism supplying a process gas to the reaction chamber; a wafer support member on which the wafer is placed; a heater for heating the wafer to a predetermined temperature; a rotation driving control mechanism for rotating the wafer; a gas exhaust mechanism including an exhaust port exhausting the gas from the reaction chamber; and an oxidized gas supply mechanism supplying an oxidized gas to an area above the exhaust port of the reaction chamber from a position lower than the horizontal position of the wafer support member. <P>COPYRIGHT: (C)2012,JPO&INPIT |
