| 摘要 |
<P>PROBLEM TO BE SOLVED: To remove a semiconductor chip which is resin-sealed using underfill from a wiring board without damaging a substrate surface, with less resin residue. <P>SOLUTION: In a semiconductor device in which a semiconductor chip 1 is mounted on a wiring board 10 through a solder bump 8, which is sealed up with a sealing resin 9, the sealing resin 9 is added with particles of a multilayer structure having a siloxane skeleton. When repairing the semiconductor chip 1, under such condition as heating is performed to degrade adhesion strength of the sealing resin 9, a peeling plate 12 is inserted into the gap between the wiring board 10 and the semiconductor chip 1 [figure (b)], and then the sealing resin 9 is peeled from the wiring board 10, for removing the semiconductor chip 1 [figure (c)]. <P>COPYRIGHT: (C)2012,JPO&INPIT |
